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 Preliminary Datasheet
CR12CM-12B
Thyristor
Medium Power Use Features
IT (AV) : 12 A VDRM : 600 V IGT : 30 mA The product guaranteed maximum junction temperature of 150C Non-Insulated Type Planar Passivation Type R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Outline
RENESAS Package code: PRSS0004AA-A (Package name: TO-220) 4 2, 4 1. 2. 3. 4. Cathode Anode Gate Anode
3 1 12 3
Applications
Switching mode power supply, regulator for autocycle, motor control, heater control, and other general purpose control applications
Maximum Ratings
Parameter Repetitive peak reverse voltage Non-repetitive peak reverse voltage DC reverse voltage Repetitive peak off-state voltage DC off-state voltage Symbol VRRM VRSM VR (DC) VDRM VD (DC) Voltage class 12 600 720 480 600 480 Unit V V V V V
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 1 of 7
CR12CM-12B
Parameter RMS on-state current Average on-state current Surge on-state current I2t for fusing Peak gate power dissipation Average gate power dissipation Peak gate forward voltage Peak gate reverse voltage Peak gate forward current Junction temperature Storage temperature Mass Symbol IT (RMS) IT (AV) ITSM I2 t PGM PG (AV) VFGM VRGM IFGM Tj Tstg -- Ratings 18.8 12 360 544 5 0.5 6 10 2 - 40 to +150 - 40 to +150 2.0 Unit A A A A2s W W V V A C C g Conditions
Preliminary
Commercial frequency, sine half wave Note2 180 conduction, Tc = 116C 60Hz sine half wave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
Typical value
Electrical Characteristics
Parameter Repetitive peak reverse current Repetitive peak off-state current On-state voltage Gate trigger voltage Gate non-trigger voltage Gate trigger current Holding current Thermal resistance Symbol IRRM IDRM VTM VGT VGD IGT IH Rth (j-c) Min. -- -- -- -- 0.2/0.1 -- -- -- Typ. -- -- -- -- -- -- 15 -- Max. 2.0/5.0 2.0/5.0 1.6 1.5 -- 30 -- 1.2 Unit mA mA V V V mA mA C/W Test conditions Tj = 125C/150C, VRRM applied Tj = 125C/150C, VDRM applied Tc = 25C, ITM = 40 A, instantaneous value Tj = 25C, VD = 6 V, IT = 1 A Tj = 125C/150C, VD = 1/2 VDRM Tj = 25C, VD = 6 V, IT = 1 A Tj = 25C, VD = 12 V Junction to caseNote1 Note2
Notes: 1. The contact thermal resistance Rth (c-f) in case of greasing is 1.0C/W. 2. Case temperature is measured at anode tab 1.5 mm away from the molded case.
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 2 of 7
CR12CM-12B
Preliminary
Performance Curves
Maximum On-State Characteristics
103 Tc = 25C
Rated Surge On-State Current
400
Surge On-State Current (A)
1.2 1.6 2.0 2.4 2.8 3.2
On-State Current (A)
320
102
240
160
101
80 0 100
100 0.8
101
102
On-State Voltage (V)
Conduction Time (Cycles at 60Hz)
102
PGM = 5 W
x 100 (%)
Gate Characteristics
Gate Trigger Current vs. Junction Temperature
103 Typical Example
Gate Voltage (V)
101
Gate Trigger Current (Tj = tC) Gate Trigger Current (Tj = 25C)
VFGM = 6 V VGT = 1.5 V PG(AV) = 0.5 W
102
100
IGT = 30 mA
IFGM =2A
101
10-1
VGD = 0.1 V
10-2 101
102
103
104
100
-40
0
40
80
120
160
Gate Current (mA)
Junction Temperature (C)
Gate Trigger Voltage (Tj = tC) Gate Trigger Voltage (Tj = 25C) x 100 (%)
Gate Trigger Voltage vs. Junction Temperature
Maximum Transient Thermal Impedance Characteristics (Junction to case)
Transient Thermal Impedance (C/W)
103 Typical Example
101
102
100
101
10-1
100 -40
0
40
80
120
160
10-2 10-4
10-3
10-2
10-1
Junction Temperature (C)
Time (s)
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 3 of 7
CR12CM-12B
Preliminary
Allowable Case Temperature vs. Average On-State Current (Single-Phase Half Wave)
160
Maximum Average Power Dissipation (Single-Phase Half Wave)
64
Average Power Dissipation (W)
56 48
360
Case Temperature (C)
140 120 90 60 180 120 100 80 60 40 20 = 30 60 120 90 180
360
Resistive, 40 inductive loads 32 24 16 6 0 0 4 8 12 = 30
Resistive, inductive loads
16
20
24
28
32
0
0
3
6
9
12
15
18
21
24
Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Half Wave)
160
Average On-State Current (A)
Maximum Average Power Dissipation (Single-Phase Full Wave)
64
Ambient Temperature (C)
140 120 100 80 60 40 20 0 0
Average Power Dissipation (W)
Resistive, inductive loads Natural convection
360
56 48 90 40 32 24 16 8 0 0 4 8 12 16 20 24

120 180 60 = 30
= 30 60 90
120 180
360
Resistive loads 28 32
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average On-State Current (A) Allowable Case Temperature vs. Average On-State Current (Single-Phase Full Wave)
160 160

Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Full Wave)
Ambient Temperature (C)
140
140 120 100 80 60 40 20 0
Case Temperature (C)
Resistive loads Natural convection
120 100 80 60 40 20 0 = 30 60 120 90 180
360
360
Resistive loads
180 120 = 30 60 90
0
4
8
12
16
20
24
28
32
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average On-State Current (A)
Average On-State Current (A)
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 4 of 7
CR12CM-12B
Preliminary
Allowable Case Temperature vs. Average On-State Current (Rectangular Wave)
160
Maximum Average Power Dissipation (Rectangular Wave)
64
Average Power Dissipation (W)
56 48
Case Temperature (C)
360
140 120 100 80 60 40 20 = 30 90 180 60 120 270 DC
360 Resistive, inductive loads
40 Resistive, inductive loads 180 270 32 120 90 DC 60 24 = 30 16 8 0 0 4 8 12 16 20 24 28 32
0
0
4
8
12
16
20
24
28
32
Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Rectangular Wave)
Average On-State Current (A)
Breakover Voltage vs. Junction Temperature
x 100 (%)
160
103
Ambient Temperature (C)
140 120 100 80 60 40 20 0
Resistive, inductive loads Natural convection
Typical Example
360
DC 270 = 30 60 90 120 180
Breakover Voltage (Tj = tC) Breakover Voltage (Tj = 25C)
102
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
101 -40
0
40
80
120
160
Average On-State Current (A)
Junction Temperature (C)
x 100 (%)
160 140 120 100 80 60 40 20 0 101 102 103 104 Typical Example Tj = 125C
x 100 (%)
Breakover Voltage vs. Rate of Rise of Off-State Voltage
Breakover Voltage vs. Rate of Rise of Off-State Voltage
160 140 120 100 80 60 40 20 0 101 102 103 104 Typical Example Tj = 150C
Breakover Voltage (dv/dt = vV/s) Breakover Voltage (dv/dt = 1V/s)
Rate of Rise of Off-State Voltage (V/s)
Breakover Voltage (dv/dt = vV/s) Breakover Voltage (dv/dt = 1V/s)
Rate of Rise of Off-State Voltage (V/s)
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 5 of 7
CR12CM-12B
Preliminary
Repetitive Peak Reverse Voltage vs. Junction Temperature Holding Current vs. Junction Temperature
x 100 (%)
x 100 (%)
160
103
Repetitive Peak Reverse Voltage (Tj = tC) Repetitive Peak Reverse Voltage (Tj = 25C)
Typical Example
140 120 100 80 60 40 20 0 -40
Typical Example
Holding Current (Tj = tC) Holding Current (Tj = 25C)
102
0
40
80
120
160
101
0
40
80
120
160
Junction Temperature (C)
Junction Temperature (C)
Gate Trigger Current vs. Gate Current Pulse Width
x 100 (%)
103 Typical Example
Gate Trigger Current (tw) Gate Trigger Current (DC)
102
101 10-1
100
101
102
Gate Current Pulse Width (s)
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
Page 6 of 7
CR12CM-12B
Preliminary
Package Dimensions
Package Name TO-220 JEITA Package Code SC-46 RENESAS Code PRSS0004AA-A Previous Code T220AB MASS[Typ.] 2.0g
Unit: mm
10.5Max
4.5 1.3
3.2
16Max
3.8Max
1.0
12.5Min
0.8
7.0
3.6
2.54
2.54
0.5
2.6
Ordering Information
Orderable Part Number CR12CM-12B#B00 CR12CM-12B-A8#B00 Packing Bag Tube Quantity 100 pcs. 50 pcs. Remark Straight type A8 Lead form
Note : Please confirm the specification about the shipping in detail.
R07DS0232EJ0100 Rev.1.00 Dec 20, 2010
4.5Max
Page 7 of 7
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". 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Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) (Note 2) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
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